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IC-MLEVALML1D 参数 Datasheet PDF下载

IC-MLEVALML1D图片预览
型号: IC-MLEVALML1D
PDF下载: 下载PDF文件 查看货源
内容描述: 霍尔位置传感器/编码器 [HALL Position Sensor / Encoder]
分类和应用: 传感器编码器
文件页数/大小: 17 页 / 327 K
品牌: ICHAUS [ IC-HAUS GMBH ]
 浏览型号IC-MLEVALML1D的Datasheet PDF文件第1页浏览型号IC-MLEVALML1D的Datasheet PDF文件第2页浏览型号IC-MLEVALML1D的Datasheet PDF文件第3页浏览型号IC-MLEVALML1D的Datasheet PDF文件第5页浏览型号IC-MLEVALML1D的Datasheet PDF文件第6页浏览型号IC-MLEVALML1D的Datasheet PDF文件第7页浏览型号IC-MLEVALML1D的Datasheet PDF文件第8页浏览型号IC-MLEVALML1D的Datasheet PDF文件第9页  
iC-ML  
HALL Position Sensor / Encoder  
Rev A3, Page 4/17  
ELECTRICAL CHARACTERISTICS  
Operating conditions: VDD = 5 V ±10 % , Tj = -40 ... 125 °C, unless otherwise noted  
Item Symbol  
No.  
Parameter  
Conditions  
Unit  
Min.  
Typ.  
Max.  
General  
001 VDD  
Supply voltage  
Supply current  
4.5  
5
5.5  
V
002  
I(VDD)  
open pins, normal operation  
open pins, power reduction mode (PRM)  
14  
7
20  
10  
mA  
mA  
003 I(VDD)sb Standby supply current  
004 td(VDD)on Turn on delay  
005 td(VDD)off Turn off delay  
Hall sensor array  
NEN = VDD  
200  
µA  
µs  
µs  
VDD > 4 V, see Fig. 9  
VDD < 2.6 V  
10  
10  
101 Hext  
Requiered external magnetic field at chip surface  
20  
50  
100  
kA/m  
strength  
102 psens  
103 ysens  
Hall sensor array pitch  
see Fig. 1  
see Fig. 1  
1.28  
0.7  
mm  
mm  
Hall sensor array distance to  
center of die  
104 xdis  
105 ydis  
106 Φdis  
107 hsens  
Lateral displacement of chip to  
package  
in TSSOP20 package, see Fig. 2  
-0.2  
-0.2  
-3  
0.2  
0.2  
3
mm  
mm  
DEG  
µm  
Vertical displacement of chip to in TSSOP20 package, see Fig. 2  
package  
Angular displacement of chip with in TSSOP20 package, see Fig. 2  
reference to package  
Distance chip surface to top of  
package  
in TSSOP20 package, see Fig. 2  
400  
Signal conditioning  
201 Voff  
Offset voltage  
on output, with external magnetic field ampli-  
tude of 20 kA/m  
-50  
-50  
50  
50  
mV  
µV/K  
202 TC(Voff)  
Temperatur coefficient of offset  
voltage  
203 Vdc  
Output mean value  
Amplitude ratio of SIN / COS  
Cut off frequency  
45  
50  
1.00  
20  
55  
%VDD  
204 Ratio  
205 fhc  
0.95  
1.05  
kHz  
µs  
V
206 t()settle  
207 V()gain  
208 V()ampl  
Settling time  
to 70 % amplitude, Hext = 40 kA/m  
V()ampl = V()max - Vdc  
80  
150  
4.0  
1.1  
Gain output voltage  
Sine/Cosine amplitude  
0.05  
0.9  
1.0  
V
Sine-to-digital converter  
301 AArel  
Relative angular error  
Oscillator frequency  
with reference to one periode, see Fig. 3  
-20  
20  
%
302 f(OSC)  
200  
256  
-0.1  
300  
kHz  
%/K  
303 TC(OSC) Temperature coefficient of oscilla-  
tor frequency  
304 hys  
Converter hysteresis  
1
LSB  
Configuration inputs CFG1, CFG2, CFG3  
401 Vt()hi  
402 Vt()lo  
403 V0()  
Threshold voltage high  
Threshold voltage low  
Open circuit voltage  
Input resistance  
60  
25  
43  
45  
78  
40  
% VDD  
% VDD  
% VDD  
kΩ  
57  
404 Ri()  
150  
-120  
450  
Enable input NEN  
501 Vt()hi  
502 Vt()lo  
503 Vt()hys  
504 Ipu()  
Threshold voltage high  
Threshold voltage low  
Hysteresis  
2
V
V
0.8  
300  
-240  
Vt()hys = Vt()hi - Vt()lo  
V() = 0...VDD - 1 V  
mV  
µA  
Pull-up current  
-25  
Digital outputs: A, B, C, D  
601 Vs()hi  
602 Vs()lo  
603 tr()  
Saturation voltage high  
Vs()hi = VDD - V(), I() = -4 mA  
I() = 4 mA  
0.4  
0.4  
60  
V
V
Saturation voltage low  
Rise time  
CL() = 50 pF  
ns  
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