iC-MH8
12 BIT ANGULAR HALL ENCODER
Rev A0.9, Page 4/25
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol
No.
Parameter
Conditions
Unit
Min.
Max.
G001 V()
Supply voltages at VPA, VPD
Zapping voltage
-0.3
-0.3
-0.3
6
8
6
V
V
V
G002 V(VZAP)
G003 V()
Voltages at A, B, Z, U, V, W, MA, SLO,
SLI, NERR, PTE
G004 I()
G005 I()
G006 I()
G007 I()
G008 Vd()
G009 Ts
G010 Tj
Current in VPA
-10
-20
20
200
100
10
mA
mA
mA
mA
kV
Current in VPD
Current in A, B, Z, U, V, W
Current in MA, SLO, SLI, NERR, PTE
ESD-voltage, all pins
Storage temperature
Chip temperature
-100
-10
HBM 100 pF discharged over 1.5 kΩ
2
-40
-40
150
135
°C
°C
THERMAL DATA
Operating conditions: VPA, VPD = 5 V ±10 %
Item Symbol
No.
Parameter
Conditions
Unit
Min. Typ. Max.
-40 125
T01 Ta
Operating Ambient Temperature Range
Thermal Resistance Chip to Ambient
°C
T02 Rthja
surface mounted to PCB, thermal pad linked
40
K/W
to cooling area of approx. 2 cm²
All voltages are referenced to ground unless otherwise stated.
All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.