Datasheet
PowerPC 970FX RISC Microprocessor
4. Dimensions and Physical Signal Assignments
The IBM PowerPC 970FX uses a ceramic ball grid array (CBGA) that supports 576 balls. Two different
substrates are used for the PowerPC 970FX. Both packages are shown in Figure 4-1, Figure 4-2, and
Figure 4-3. Note that they are identically dimensioned.
4.1 Electrostatic Discharge Considerations
Appropriate electrostatic discharge (ESD) handling procedures should be implemented and maintained for
any facilities handling this component.
This product has been ESD tested to meet or exceed the Joint Electron Device Engineering Council (JEDEC)
specifications JESD22-A114C.01, JESD22-C101C, and JESD22-A115-A for the following models:
• Human body model (HBM) - Class 1B
• Field-induced charged device model (CDM) - Class II
• Machine model (MM) - Class A.
4.2 Mechanical Packaging
4.2.1 Standard Lead Package Version
Figure 4-1 on page 46 and Figure 4-2 on page 47 show the side and top views of the packages including the
height from the top of the die to the bottom of the solder balls. Figure 4-3 on page 48 shows a bottom view of
the PowerPC 970FX.
Version 2.5
Dimensions and Physical Signal Assignments
Page 45 of 78
March 26, 2007
IBM [ IBM ]
