PowerPC 740 and PowerPC 750 Microprocessor
CMOS 0.20 µm Copper Technology, PID-8p, PPC740L and PPC750L, dd3.2
Table of Contents
Preface ..................................................................................................................................................... 5
New Features for dd3.x ............................................................................................................................ 5
Overview................................................................................................................................................... 6
Features ................................................................................................................................................... 7
General Parameters ................................................................................................................................. 9
Electrical and Thermal Characteristics................................................................................................... 10
DC Electrical Characteristics ..............................................................................................................10
AC Electrical Characteristics .................................................................................................................. 14
Clock AC Specifications ......................................................................................................................14
Spread Spectrum Clock Generator (SSCG) .......................................................................................15
60x Bus Input AC Specifications .........................................................................................................16
60x Bus Output AC Specifications ......................................................................................................18
L2 Clock AC Specifications .................................................................................................................20
L2 Bus Input AC Specifications ...........................................................................................................22
L2 Bus Output AC Specifications ........................................................................................................23
IEEE 1149.1 AC Timing Specifications .................................................................................................. 25
PowerPC 740 Microprocessor Pin Assignments.................................................................................... 27
PowerPC 740 Package .......................................................................................................................... 30
Mechanical Dimensions of the PowerPC 740 255 CBGA Package ....................................................31
PowerPC 750 Microprocessor Pin Assignments.................................................................................... 32
PowerPC 750 Package .......................................................................................................................... 35
Mechanical Dimensions of the PowerPC 750 360 CBGA Package ....................................................36
System Design Information .................................................................................................................... 38
PLL Power Supply Filtering .................................................................................................................41
Decoupling Recommendations ...........................................................................................................41
Connection Recommendations ...........................................................................................................41
Output Buffer DC Impedance ..............................................................................................................42
Pull-up Resistor Requirements ...........................................................................................................43
Thermal Management Information ......................................................................................................45
Internal Package Conduction Resistance ...........................................................................................46
Heat Sink Selection Example ..............................................................................................................48
Ordering Information............................................................................................................................... 51
09/06/2002
Version 2.0
Page 3
IBM [ IBM ]
