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IBM25PPC750L-EB0C366W 参数 Datasheet PDF下载

IBM25PPC750L-EB0C366W图片预览
型号: IBM25PPC750L-EB0C366W
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 46 页 / 610 K
品牌: IBM [ IBM ]
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PowerPC 750 SCM RISC Microprocessor  
PID8p-750  
Preliminary Copy  
Figure 21. Thermalloy #2328B Pin-Fin Heat Sink-to-Ambient Thermal Resistance vs. Air flow Velocity  
Thermalloy #2328B Pin-fin Heat Sink  
(25 x 28 x 15 mm)  
8
7
6
5
4
3
2
1
0
0.5  
1
1.5  
2
2.5  
3
3.5  
Approach Air Velocity (m/s)  
Assuming an air velocity of 0.5m/s, we have an effective θSA of 7°C/W, thus  
TJ = 30°C + 5°C + (2.2°C/W +1.0°C/W + 7°C/W) × 4.5W,  
resulting in a junction temperature of approximately 81°C which is well within the maximum operating temper-  
ature of the component.  
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Aavid, and Wakefield Engineering offer different  
heat sink-to-ambient thermal resistances, and may or may not need air flow.  
Though the junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure-of-  
merit used for comparing the thermal performance of various microelectronic packaging technologies, one  
should exercise caution when only using this metric in determining thermal management because no single  
parameter can adequately describe three-dimensional heat flow. The final chip-junction operating tempera-  
ture is not only a function of the component-level thermal resistance, but the system-level design and its oper-  
ating conditions. In addition to the component's power dissipation, a number of factors affect the final  
operating die-junction temperature. These factors might include air flow, board population (local heat flux of  
adjacent components), heat sink efficiency, heat sink attach, next-level interconnect technology, system air  
temperature rise, etc.  
9/30/99  
Version 2.0  
Datasheet  
Page 39  
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