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IBM25PPC750L-EB0C366W 参数 Datasheet PDF下载

IBM25PPC750L-EB0C366W图片预览
型号: IBM25PPC750L-EB0C366W
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 46 页 / 610 K
品牌: IBM [ IBM ]
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PowerPC 750 SCM RISC Microprocessor  
PID8p-750  
Preliminary Copy  
Internal Package Conduction Resistance  
For the exposed-die packaging technology, shown in Table “Package Thermal Characteristics,” on page 7,  
the intrinsic conduction thermal resistance paths are as follows.  
• Die junction-to-case thermal resistance  
• Die junction-to-lead thermal resistance  
Figure 19 depicts the primary heat transfer path for a package with an attached heat sink mounted to a  
printed-circuit board.  
Figure 19. C4 Package with Heat Sink Mounted to a Printed-Circuit Board  
External Resistance  
Radiation  
Convection  
Heat Sink  
Thermal Interface Material  
Die/Package  
Chip Junction  
Internal Resistance  
Package/Leads  
Printed-Circuit Board  
Radiation  
Convection  
External Resistance  
(Note the internal versus external package resistance.)  
Heat generated on the active side (ball) of the chip is conducted through the silicon, then through the heat  
sink attach material (or thermal interface material), and finally to the heat sink; where it is removed by forced-  
air convection. Since the silicon thermal resistance is quite small, for a first-order analysis, the temperature  
drop in the silicon may be neglected. Thus, the heat sink attach material and the heat sink conduction/con-  
vective thermal resistances are the dominant terms.  
Adhesives and Thermal Interface Materials  
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the thermal  
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,  
Figure 20 shows the thermal performance of three thin-sheet thermal-interface materials (silicon, graphite/oil,  
floroether oil), a bare joint, and a joint with thermal grease, as a function of contact pressure. As shown, the  
performance of these thermal interface materials improves with increasing contact pressure. The use of ther-  
mal grease significantly reduces the interface thermal resistance. That is, the bare joint results in a thermal  
resistance approximately 7 times greater than the thermal grease joint.  
Page 36  
Version 2.0  
Datasheet  
9/30/99  
 
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