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IBM25PPC750L-EB0C366W 参数 Datasheet PDF下载

IBM25PPC750L-EB0C366W图片预览
型号: IBM25PPC750L-EB0C366W
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 46 页 / 610 K
品牌: IBM [ IBM ]
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PowerPC 750 SCM RISC Microprocessor  
PID8p-750  
Preliminary Copy  
Dow-Corning Corporation  
Dow-Corning Electronic Materials  
P.O. Box 0997  
517-496-4000  
Midland, MI 48686-0997  
Chomerics, Inc.  
77 Dragon Court  
Woburn, MA 01888-4850  
617-935-4850  
216-741-7659  
860-571-5100  
609-882-2332  
Thermagon, Inc.  
3256 West 25th Street  
Cleveland, OH 44109-1668  
Loctite Corporation  
1001 Trout Brook Crossing  
Rocky Hill, CT 06067  
AI Technology (e.g. EG7655)  
1425 Lower Ferry Road  
Trent, NJ 08618  
The following section provides a heat sink selection example using one of the commercially available heat  
sinks.  
Heat Sink Selection Example  
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows.  
TJ = TA + TR + (θJC + θINT + θSA) × PD  
Where:  
TJ is the die-junction temperature  
TA is the inlet cabinet ambient temperature  
TR is the air temperature rise within the system cabinet  
θJC is the junction-to-case thermal resistance  
θINT is the thermal resistance of the thermal interface material  
θSA is the heat sink-to-ambient thermal resistance  
PD is the power dissipated by the device  
Typical die-junction temperatures (TJ) should be maintained less than the value specified in Table “Package  
Thermal Characteristics,” on page 7. The temperature of the air cooling the component greatly depends upon  
the ambient inlet air temperature and the air temperature rise within the computer cabinet. An electronic cab-  
inet inlet-air temperature (TA) may range from 30 to 40°C. The air temperature rise within a cabinet (TR) may  
be in the range of 5 to 10°C. The thermal resistance of the interface material (θINT) is typically about 1°C/W.  
Assuming a TA of 30°C, a TR of 5°C, a CBGA package θJC = 0.03, and a power dissipation (PD) of 5.0 watts, the  
following expression for TJ is obtained.  
Die-junction temperature: TJ = 30°C + 5°C + (0.03°C/W +1.0°C/W + θSA) × 5W  
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (θSA) versus air flow velocity  
is shown in Figure 21.  
Page 38  
Version 2.0  
Datasheet  
9/30/99  
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