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IBM25PPC750L-EB0C366W 参数 Datasheet PDF下载

IBM25PPC750L-EB0C366W图片预览
型号: IBM25PPC750L-EB0C366W
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 366MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 46 页 / 610 K
品牌: IBM [ IBM ]
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PowerPC 750 SCM RISC Microprocessor  
PID8p-750  
Preliminary Copy  
Thermal Management Information  
This section provides thermal management information for the CBGA package for air cooled applications.  
Proper thermal control design is primarily dependent upon the system-level design; that is, the heat sink, air  
flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be attached  
to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, and  
mounting clip and screw assembly, see Figure 18.  
Figure 18. Package Exploded Cross-Sectional View with Several Heat Sink Options  
CBGA Package  
Heat Sink  
Heat Sink clip  
Adhesive  
or  
Thermal  
Interface  
Material  
Printed  
Circuit  
Board  
Option  
Maximum Heatsink Weight Limit for the 360 CBGA  
Force  
Maximum (pounds)  
Dynamic Compression  
Dynamic Tensile  
10.0  
2.5  
Static Constant (Spring Force)  
8.2  
Page 34  
Version 2.0  
Datasheet  
9/30/99  
 
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