PowerPC 750 SCM RISC Microprocessor
PID8p-750
Preliminary Copy
1,2,3
Recommended Operating Conditions
Characteristic
Symbol
L2OVDD(2.5V)
L2OVDD(1.8V)
VIN(60X)
Value
Unit
V
L2 bus supply voltage, pin A19 tied to HRESET
L2 bus supply voltage, pin A19 tied to GND
2.375 to 2.625
1.71 to 1.89
GND to OVDD
GND to L2OVDD
0 to 105
V
Input voltage (under AC conditions, inputs must go rail to
rail for maximum AC timing performance)
V
VIN(L2)
V
Die-junction temperature
TJ
°C
Note:
1. These are recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed.
2. For dd3.x, If W1 is left unconnected, the 60X bus will default to OVDD = 3.3V. For dd2x, W1=Don’t care
3. For dd3.x, If A19 is left unconnected, the L2 bus will default to L2OVDD = 3.3V. For dd2x, W1=Don’t care
The following table provides the package thermal characteristics for the PID8p-750.
Package Thermal Characteristics
Characteristic
Symbol
Value
0.03
Unit
CBGA package thermal resistance, junction-to-case ther-
mal resistance (typical)
θJC
°C/W
CBGA package thermal resistance, junction-to-lead ther-
mal resistance (typical)
θJB
3.8
°C/W
Note: Refer to Section “Thermal Management Information,” on page 34 for more information about thermal management.
The PID8p-750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-
to-analog converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750
RISC Microprocessor User’s Manual for more information on the use of this feature. Specifications for the
thermal sensor portion of the TAU are found in the table below.
Thermal Sensor Specifications
See Table “Recommended Operating Conditions1,2,3,” on page 6, for operating conditions.
Num
Characteristic
Minimum
Maximum
Unit
°C
Notes
1
2
3
Temperature range
Comparator settling time
Resolution
0
20
4
128
—
1
2
3
ms
°C
—
Note:
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact your local
IBM sales office. This specification reflects the temperature span supported by the design.
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.
3. This value is guaranteed by design and is not tested.
9/30/99
Version 2.0
Datasheet
Page 7
IBM [ IBM ]
