PowerPC 750FL RISC Microprocessor
Preliminary
Figure 4-2. Mechanical Dimensions and Bottom Surface Nomenclature of the Reduced Lead CBGA Package
B1
B
Notes:
1. Dimensioning and tolerancing per
ASME Y14.5M, 1994.
2. Dimensions in millimeters.
Millimeters
DIM
A
Minimum
Maximum
21 ± 0.2
A2
A1
A2
B
7.122
1.5
A1
A
21 ± 0.2
5.412
B1
C
1.5 Maximum
2.5 Maximum
D
F
2.302
2.828
2.228
0.908
F1
G
1.902
0.822
G1
H
(7x) (0.51 Max)
1.56
1.08
0.40
1.90
H1
H2
1
1.32
0.60
1.0
0.7 ± 0.1
2
A01
Corner
Y
W
V
U
T
R
N
M
L
K
J H G F E D C B A
P
20
19
18
17
16
15
14
13
12
11
10
9
F
F1
D
C
8
7
6
5
4
(19X)
1
3
2
1
H1
G1
G
(bottom side view)
(19X)
1
H2
A01 Corner
2
292X
H
0.25C A B
C
0.1
Not To Scale
Note: All caps on the SCM are lower in height than the processor die.
Dimensions and Signal Assignments
Page 30 of 65
750flds60.fm.6.0
April 27, 2007
IBM [ IBM ]
