Preliminary
PowerPC 750FL RISC Microprocessor
4. Dimensions and Signal Assignments
IBM offers a CBGA that supports 292 balls for the 750FL microprocessor package.
4.1 Module Substrate Decoupling Voltage Assignments
The on-board substrate voltage-to-ground assignments for the capacitor locations are shown in Figure 4-1.
Figure 4-1. Module Substrate Decoupling Voltage Assignments
GND
OV
DD
V
GND
GND
DD
OV
V
GND
GND
DD
OV
DD
DD
OV
V
DD
DD
GND
GND
A01
Corner
4.2 Package
The module mass is approximately 2.44 grams; the ball pitch is 1 mm; the ball diameter target is approxi-
mately 0.635 mm; and the JEDEC moisture sensitivity level (MSL) is 2. For pad, line, via, and dogbone
recommendations, see Printed Wiring Board Tech for 1.0 mm Pitch Modules.
Note: Use the A01 corner designation for correct placement. Use the five plated dots that form a right angle
(|_) to locate the A01 corner as shown in Figure 4-2 on page 30.
750flds60.fm.6.0
April 27, 2007
Dimensions and Signal Assignments
Page 29 of 65
IBM [ IBM ]
