Preliminary
PowerPC 750FL RISC Microprocessor
Note: All electrical specifications (ac, dc, timing) are guaranteed only when the device is operated within the
recommended operating conditions (see Table 3-2). Operation at other application conditions can also be
possible; contact IBM PowerPC Application engineering for details.
Table 3-2. Recommended Operating Conditions
Characteristic
Core supply voltage (full-on mode)
PLL supply voltage
Symbol
VDD
Value
Unit
V
Notes
1.3 − 1.5
1, 2
2
AVDD
OVDD
OVDD
OVDD
VIN
1.3 − 1.5
V
60x bus supply voltage (1.8 V)
60x bus supply voltage (2.5 V)
60x bus supply voltage (3.3 V)
Input voltage
1.7 − 1.9
V
2
2.375 − 2.625
3.135 − 3.465
GND − OVDD
-40 − 105
V
2
V
V
2
Die junction temperature
Notes:
TJ
°C
1. In some cases, when using 1.8 V or 2.5 V I/O mode, it is possible to reduce power dissipation by lowering the core power supply.
2. These are tested operating conditions.
Table 3-3. Package Thermal Characteristics
Characteristic1
CBGA package thermal resistance, junction-to-case thermal resistance (typical)
CBGA package thermal resistance, junction-to-lead thermal resistance (typical)
Notes:
Symbol2
θJC
Value
0.06
7.6
Unit
°C/W
°C/W
θJB
1. A heat sink is required. See Section 5.8 Thermal Management on page 56 for more information.
2. θJC is the internal resistance from the junction to the back of the die. For more information about thermal management, see
Section 5.8 Thermal Management.
750flds60.fm.6.0
April 27, 2007
Electrical and Thermal Characteristics
Page 17 of 65
IBM [ IBM ]
