DD 2.X
Preliminary
PowerPC 750FX RISC Microprocessor
Figure 4-2. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
B1
B
Notes:
4. Dimensioning and tolerancing per ASME
Y14.5M, 1994.
5. Dimensions in millimeters.
Millimeters
DIM
A
Minimum
Maximum
21 0.2
A2
A1
A2
B
7.03
1.5
21 0.2
5.32
1.5
A1
A
B1
C
C1
C2
D
0.48
0.51
2.5
F
2.569
1.859
0.779
3.087
2.177
0.857
0.51
F1
G
G1
(7x) 0.20
2.23
H1.79
H1
H2
1.08
1.32
0.91
0.71
A01
Corner
Y
W
V
U
T
R
N
M
L
K
J H G F E D C B A
P
20
19
18
17
16
15
14
13
12
11
10
9
F
F1
C1
D
8
C2
C
7
6
5
4
(19X)
1
3
2
1
H1
G1
G
(bottom side view)
(19X)
1
H2
A01 Corner
292X
b
H
0.3 C A B
C
0.1
Not To Scale
Note: All caps on the SCM are lower in height than the processor die.
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
4. Dimensions and Signal Assignments
Page 23 of 63
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