DD 2.X
PowerPC 750FX RISC Microprocessor
Preliminary
4. Dimensions and Signal Assignments
IBM offers a ceramic ball grid array (CBGA) which supports 292 balls for the 750FX package.
4.1 Module Substrate Decoupling Voltage Assignments
The on-board substrate voltage-to-ground assignments for the capacitor locations are shown in Figure 4-1.
Figure 4-1. Module Substrate Decoupling Voltage Assignments
GND
OV
DD
V
GND
GND
DD
OV
V
GND
GND
DD
OV
DD
DD
OV
V
DD
DD
GND
GND
A01
Corner
4.2 Package
Module mass is approximately 3.25 grams. Ball pitch is 1 mm. Ball diameter target is 0.8 mm +/- 0.04 mm.
JEDEC moisture sensitivity level is 1. For pad, line, via, and dogbone recommendations, ask for “Printed
Wiring Board Tech For 1.0 mm Pitch Modules.”
Note: Use A01 corner designation for correct placement. Use the five plated dots that form a right angle (|_)
to locate the A01 corner as shown in Figure 4-2 Mechanical Dimensions and Bottom Surface Nomenclature
of the CBGA Package on page 23.
4. Dimensions and Signal Assignments
Page 22 of 63
Body_750FX_DS_DD2.X.fm.2.0
June 9, 2003
IBM [ IBM ]
