Data Sheet
PowerPC® 750CXe RISC Microprocessor
Preliminary
Table 4-3 provides the package thermal characteristics for the PowerPC 750CXe.
Table 4-3. Package Thermal Characteristics
Characteristic
Symbol
Value
15.9
Unit
PBGA package thermal resistance, junction to ambient,
θJA
°C/W
1
thermal resistance, convection only
PBGA package thermal resistance, junction-to-ambient
thermal resistance, 100 linear ft. per minute
θJA
θJB
θJC
13.9
7.4
°C/W
°C/W
°C/W
PBGA package thermal resistance, junction-to-board
thermal resistance
PBGA package thermal resistance, junction-to-case
thermal resistance
0.7
Note:
1. Assumes that the package is soldered to a 2S2P board.
Table 4-4 provides DC electrical characteristics for the PowerPC 750CXe.
Table 4-4. DC Electrical Specifications See Table 4-2 on page 7 for recommended operating conditions.
Voltage
Characteristic
Input high voltage (all inputs except SYSCLK)
Input low voltage (all inputs except SYSCLK)
SYSCLK input high voltage
Symbol
Unit
Notes
Min
+1.24
+1.90
GND
GND
+1.20
+1.90
GND
–
Max
+1.90
+2.625
+0.60
+0.70
+1.90
+2.625
+0.4
20
VIH (1.8V)
VIH(2.5V)
VIL(1.8V)
VIL(2.5V)
CVIH(1.8V)
CVIH(2.5V)
CVIL(1.8V/2.5V)
IIN
V
V
2, 4
2
V
4
V
V
V
SYSCLK input low voltage
V
Input leakage current, VIN = OVDD = 2.5V
Input leakage current, VIN = OVDD = 1.8V
Hi-Z (off state) leakage current, VIN = OVDD= 2.5V
Hi-Z (off state) leakage current, VIN = OVDD= 1.8V
µA
µA
µA
µA
V
3
3
3
3
IIN
–
20
ITSI
–
20
ITSI
–
20
VOH(1.8V)
VOH(2.5V)
VOL(1.8V, 2.5V)
CIN
+1.30
+2.00
–
–
Output high voltage, IOH = –4mA
–
V
Output low voltage, IOL = 4mA
Capacitance, VIN =0 V, f = 1MHz
Notes:
+0.4
+5.0
V
–
pF
1
1. Capacitance values are guaranteed by design and characterization, and are not tested.
2. Maximum input high voltage for short duration (not continuous operation).
3. Additional input current may be attributed to the Level Protection Keeper Lock circuity. For details, see Section 6.7 on Page 33.
4. VIH and VIL minimum levels are set as a percentage of VDD. VIH is 65% and VIL is 35% respectively.
Electrical and Thermal Characteristics
Page 8 of 36
750cxe_DD3.1_Dev_3_gen_mkt.fm.1.5
April 8, 2004
IBM [ IBM ]
