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IBM25EMPPC750LCBE4000 参数 Datasheet PDF下载

IBM25EMPPC750LCBE4000图片预览
型号: IBM25EMPPC750LCBE4000
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360]
分类和应用: 时钟外围集成电路
文件页数/大小: 50 页 / 600 K
品牌: IBM [ IBM ]
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PowerPC 740 and PowerPC 750 Embedded Microprocessor  
IBM CMOS 0.20 um Copper Technology EMPPC740L and EMPPC750L  
1
Package Thermal Characteristics  
Characteristic  
Symbol  
740  
750  
Unit  
Thermal resistance, junction-to-case (top sur-  
face of die) typical  
θJC  
0.03  
0.03  
°C/W  
2
2
Thermal resistance, junction-to-balls, typical  
θJB  
°C/W  
3.8 - 7.1  
16.0  
3.8 - 7.6  
15.1  
Thermal resistance, junction-to-ambient, at air-  
flow, no heat sink, typical  
50 FPM  
100 FPM  
150 FPM  
200 FPM  
°C/W  
°C/W  
°C/W  
°C/W  
15.4  
16.4  
14.9  
14.2  
14.4  
13.7  
2
Package Size  
Die Size  
Note:  
21 x 21  
25 x 25  
mm  
2
5.12 x 7.78  
5.12 x 7.78  
mm  
1. Refer to Section “Thermal Management Information,” on page 39 for more information about thermal management.  
2. 3.8 °C/W is theoretical θJB mounted to infinite heat sink. The larger number applies to module mounted to a 1.8 mm thick, 2P card using 1 oz. copper  
power/gnd planes, with effective area for heat transfer of 75mm x 75mm.  
The 750 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-ana-  
log converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the 750 PPC  
Microprocessor User’s Manual for more information on the use of this feature. Specifications for the thermal  
sensor portion of the TAU are found in the table below.  
.
Thermal Sensor Specifications  
See Table “Recommended Operating Conditions,” on page 7, for operating conditions.  
Num  
Characteristic  
Minimum  
Maximum  
Unit  
°C  
Notes  
1
2
3
4
5
6
Temperature range  
Comparator settling time  
Resolution  
0
20  
4
128  
.25  
1
1
2
3
ms  
°C  
Drift, all sources  
LSb  
LSb  
LSb  
Linearity, error over range  
Offset error, reducible  
2
Note:  
1. The temperature is the junction temperature of the die. The thermal assist unit's (TAU) raw output does not indicate an absolute temperature, but it  
must be interpreted by software to derive the absolute junction temperature. For information on how to use and calibrate the TAU, contact your local  
IBM sales office. This specification reflects the temperature span supported by the design.  
2. The comparator settling time value must be converted into the number of CPU clocks that need to be written into the THRM3 SPR.  
3. This value is guaranteed by design and is not tested.  
Page 8  
Version 1.51  
PowerPC 740 and PowerPC 750 Datasheet  
5/20/99  
 
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