4.0 PPC740 and PPC750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PPC740 and PPC750. IBM
offers two ceramic ball grid array (BGA) packages: a 255 CBGA (the PPC740) and a 360
CBGA (the PPC750).
surface. Part B shows the side profile of the 255 CBGA package to indicate the direc-
tion of the top surface view.
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Not to Scale
Part B
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Substrate
Assem-
View
Encapsulation
Die
Figure 13. Pinout of the PPC740 BGA Package as Viewed from the Top Surface
surface. Part B shows the side profile of the 360 CBGA package to indicate the direc-
tion of the top surface view.
PPC740 and PPC750 Hardware Specifications
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Preliminary and subject to change without notice
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