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IBM11M4735CB-60T 参数 Datasheet PDF下载

IBM11M4735CB-60T图片预览
型号: IBM11M4735CB-60T
PDF下载: 下载PDF文件 查看货源
内容描述: [EDO DRAM Module, 4MX72, 60ns, CMOS, DIMM-168]
分类和应用: 动态存储器内存集成电路
文件页数/大小: 30 页 / 791 K
品牌: IBM [ IBM ]
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Discontinued (9/98 - last order; 3/99 - last ship)
IBM11M4735C
IBM11M4735CB
4M x 72 DRAM Module
DC Electrical Characteristics
Symbol
I
CC1
(T
A
= 0 to +70°C, V
CC
= 3.3V
±
0.3V or V
CC
= 5.0V
±
0.5V)
Parameter
Min.
-50
-60
-50
-60
-50
-60
-50
-60
All but RAS
RAS
-10
-90
-10
Max.
1530
1350
36
1530
1350
1530
1170
18
1530
1350
+10
+90
+10
mA
1, 3
mA
1, 2, 3
mA
1, 3
mA
1, 2, 3
Units
Notes
Operating Current
Average Power Supply Operating Current
(RAS, CAS, Address Cycling: t
RC
= t
RC
min.)
Standby Current (TTL)
Power Supply Standby Current
(RAS = CAS = V
IH
)
RAS Only Refresh Current
Average Power Supply Current, RAS Only Mode
(RAS Cycling, CAS = V
IH
: t
RC
= t
RC
min)
EDO Page Mode Current
Average Power Supply Current, EDO Page Mode
(RAS = V
IL
, CAS, Address Cycling: t
HPC
= t
HPC
min)
Standby Current (CMOS)
Power Supply Standby Current
(RAS = CAS = V
CC
- 0.2V)
CAS Before RAS Refresh Current
Average Power Supply Current, CAS Before RAS Mode
(RAS, CAS, Cycling: t
RC
= t
RC
min)
Input Leakage Current
Input Leakage Current, any input
(0.0
V
IN
(V
CC
+ 0.3V)), All Other Pins Not Under Test = 0V
Output Leakage Current
(D
OUT
is disabled, 0.0
V
OUT
V
CC
)
Output Level (TTL)
Output “H” Level Voltage
(I
OUT
= -2.5mA for 3.3V, or I
OUT
= -5mA for 5.0V)
Output Level (TTL)
Output “L” Level Voltage
(I
OUT
= +2.1mA for 3.3V, or I
OUT
= +4.2mA for 5.0V)
I
CC2
mA
I
CC3
I
CC4
I
CC5
mA
I
CC6
I
I(L)
I
O(L)
V
OH
µA
µA
2.4
V
CC
V
V
OL
0.0
0.4
V
1. I
CC1
, I
CC3
, I
CC4
, and I
CC6
depend on cycle rate.
2. I
CC1
and I
CC4
depend on output loading. Specified values are obtained with the output open.
3. Address can be changed once or less while RAS =V
IL
. In the case of I
CC4
, it can be changed once or less when CAS =V
IH
.
AC Characteristics
(T
A
= 0 to +70°C, VCC = 3.3V
±
0.3V or 5.0V
±
0.5V)
1. V
IH
(min) and V
IL
(max) are reference levels for measuring timing of input signals. Transition times are measured between V
IH
and
V
IL
.
2. An initial pause of 200µs is required after power-up followed by 8 RAS only refresh cycles before proper device operation is
achieved. In case of using internal refresh counter, a minimum of 8 CAS before RAS refresh cycles instead of 8 RAS only refresh
cycles is required.
3. The specified timings include buffer, loading, and skew delay adders: 2ns minimum, 5ns maximum delay, no pulse shrinkage to the
DRAM device timings. The data and RAS signals are not buffered, which preserves the DRAMs access specifications of 50ns and
60ns.
4. AC measurements assume t
T
= 2ns.
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
50H4201.E20982E
Revised 8/98
Page 6 of 30