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IBM0625404GT3B-10E 参数 Datasheet PDF下载

IBM0625404GT3B-10E图片预览
型号: IBM0625404GT3B-10E
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 64MX4, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66]
分类和应用: 动态存储器双倍数据速率光电二极管内存集成电路
文件页数/大小: 75 页 / 1245 K
品牌: IBM [ IBM ]
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IBM0625164GT3B IBM0625404GT3B  
IBM06254B4GT3B IBM0625804GT3B  
Advance  
256Mb Double Data Rate Synchronous DRAM  
Electrical Characteristics & AC Timing for PC266 - Applicable Specifications  
Expressed in Clock Cycles (0 °C TA 70 °C; VDDQ = 2.5V ± 0.2V; VDD = 2.5V ± 0.2V, See AC  
Characteristics) (Part 2 of 2)  
t
= 7.5ns  
CK  
Symbol  
Parameter  
Units  
ns  
Notes  
Min  
3.0  
6
Max  
t
Read postamble  
4.5  
1-4  
1-4  
1-4  
RPST  
t
Active to Precharge command  
16000  
t
t
RAS  
CK  
CK  
t
Active to Active/Auto-refresh command period  
9
RC  
Auto-refresh to Active/Auto-refresh  
command period  
t
10  
t
1-4  
RFC  
RCD  
CK  
t
Active to Read or Write delay  
3
3
t
t
t
t
t
t
t
t
1-4  
1-4  
CK  
CK  
CK  
CK  
CK  
CK  
CK  
CK  
t
Precharge command period  
RP  
RRD  
t
Active bank A to Active bank B command  
Write recovery time  
2
1-4  
t
2
1-4  
WR  
DAL  
WTR  
t
Auto precharge write recovery + precharge time  
Internal write to read command delay  
Exit self-refresh to non-read command  
Exit self-refresh to read command  
Average Periodic Refresh Interval  
QFC setup time on Read  
5
1-4  
t
1
1-4  
t
t
10  
200  
1-4  
XSNR  
XSRD  
1-4  
t
7.8  
8.25  
4.5  
µs  
ns  
ns  
ns  
ns  
1-4, 8  
1-4  
REFI  
t
6.75  
3.0  
QCS  
QCH  
t
QFC hold time on Read  
1-4  
t
Delay from CK edge of write command to QFC low on write  
QFC hold time on write  
4.0  
1-4, 9  
1-4, 10  
QCSW  
QCHW  
t
1.25  
2.0  
1. Input slew rate = 1V/ns  
2. The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for  
signals other than CK/CK, is V  
REF.  
3. Inputs are not recognized as valid until V  
stabilizes.  
REF  
4. The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (Note 3) is V  
.
TT  
5. t and t transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a  
HZ  
LZ  
specific voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).  
6. The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system  
performance (bus turnaround) degrades accordingly.  
7. The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge. A valid  
transition is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in  
progress on the bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH,  
LOW, or transitioning from HIGH to LOW at this time, depending on t  
.
DQSS  
8. A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.  
9. QFC is enabled as soon as possible after the rising CK edge that registers the Write command.  
10. QFC is disabled as soon as possible after the last valid DQS edge transitions Low.  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
29L0011.E36997  
10/99  
Page 59 of 75  
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