FH33 Seriesꢀ0.4mm,0.5mm,1mm Pitch, 1.2mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors
ꢀRecommended Temperature Profile
Using Lead-free Solder paste
ꢀ
HRS test conditions
MAX 250ç
Solder method : Reflow, IR/hot air
Environment : Room air
250
200
150
100
50
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
230ç
(Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-32-10.5)
200ç
Test board
: Glass epoxy 25mm∞50mm∞0.8mm thick
Land dimensions : Contacts lead 0.3mm∞0.65mm
Metal fittings 0.55mm∞0.8mm
150ç
Metal mask
: Contacts lead 0.25mm∞0.65mm∞0.1mm thick
Metal fittings 0.55mm∞0.8mm∞0.1mm thick
(ç)
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
25ç
(60 sec.)
90 to 120 sec.
(60 sec.)
Sodering
0
Preheating
Start
Time (Seconds)
10
HRS [ HRS ]
