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HT16C21 参数 Datasheet PDF下载

HT16C21图片预览
型号: HT16C21
PDF下载: 下载PDF文件 查看货源
内容描述: 内存映射20 ×4/ 16 * 8的LCD驱动器控制器 [RAM Mapping 20*4 / 16*8 LCD Driver Controller]
分类和应用: 驱动器控制器
文件页数/大小: 34 页 / 1626 K
品牌: HOLTEK [ HOLTEK SEMICONDUCTOR INC ]
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HT16C21  
Pin Description  
Pin Name  
Type  
Description  
SDA  
SCL  
VDD  
VSS  
I/O Serial data input/output for I2C interface  
I
Serial clock input for I2C interface  
Positive power supply.  
Negative power supply, ground.  
One external resistor is connected between the VLCD pin and the VDD  
pin to determine the bias voltage for the package with a VLCD pin.  
Internal voltage adjustment function is disabled.  
Internal voltage adjustment function can be used to adjust the VLCD  
voltage. If the VLCD pin is used as voltage detection pin, an external  
power supply should not be applied to the VLCD pin.  
VLCD  
An external MCU can detect the voltage of the VLCD pin and program the  
internal voltage adjustment for the packages with a VLCD pin.  
COM0~COM3  
O
O
O
LCD common outputs.  
COM4/SEG0~COM7/SEG3  
SEG4~SEG19  
LCD common/segment multiplexed driver outputs  
LCD segment outputs.  
Approximate Internal Connections  
SCL, SDA (for schmit Trigger type)  
COM0~COM7; SEG0~SEG19  
Vselect-on  
VDD  
Vselect-off  
VSS  
Absolute Maximum Ratings  
Supply voltage ......................................................................................................................VSS 0.3V to V +6.5V  
SS  
Input voltage ........................................................................................................................VSS 0.3V to VDD+0.3V  
Storage temperature .......................................................................................................................-55°C to +150°C  
Operating temperature .....................................................................................................................-40°C to +85°C  
Note: These are stress ratings only. Stresses exceeding the range specified under "Absolute Maximum Ratings"  
may cause substantial damage to the device. Functional operation of this device at other conditions beyond  
those listed in the specification is not implied and prolonged exposure to extreme conditions may affect  
device reliability.  
Rev. 1.00  
5
November 22, 2011  
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