HMC1190LP6GE
v01.1112
BROADBAND HIGH IP3 DUAL CHANNEL DOWNCONVERTER
w/ Fractional-N PLL & VCO, 0.7 - 3.5 GHz
Absolute Maximum Ratings
Recommended Operating Conditions
RF Input Power (VBIASIF1,2= +5V, LOVDD=3.0V)
+20 dBm
6V
VDDCP, VCS1, VCS2, VBIASIF1, VBIASIF2,LO
BIAS1,LOBIAS2,VCC1,VCC2,VGATE1,VGATE2
,VDDLS
5.0 V
VBIASIF1,2, LOVDD
VGATE1,2, VDDCP, VCS1, VCS2, LOVDD
3VRVDD, DVDD3V
-0.3V to +5.5V
-0.3V to +3.6V
150°C
LOVDD, 3VRVDD, DVDD3V, VCCPD, VCCPS,
VCCHF
+3.3 V
Max. Channel Temperature
Operating Temperature
-40 to +85°C
Thermal Resistance
(channel to ground paddle)
3.3°C/W
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
-65 to 150°C
-40 to +85°C
Class 1B
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND
SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. CHARACTERS TO BE HELVETICA MEDIUM, .025 HIGH, WHITE INK, OR LASER MARK
LOCATED APPROX. AS SHOWN.
7. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.05mm MAX.
8. PACKAGE WARP SHALL NOT EXCEED 0.05mm
9. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
10. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
H1190
XXX
MSL1 [1]
HMC1190LP6GE
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 260°C
[2] 4-Digit lot number XXXX
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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HITTITE [ HITTITE MICROWAVE CORPORATION ]
