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HD6473434F16 参数 Datasheet PDF下载

HD6473434F16图片预览
型号: HD6473434F16
PDF下载: 下载PDF文件 查看货源
内容描述: 12伏不能应用于S -掩模模型(单电源规格) ,因为这可能会永久损坏设备。 [12 V must not be applied to the S-mask model (single-power-supply specification), as this may permanently damage the device.]
分类和应用: 外围集成电路微控制器可编程只读存储器时钟
文件页数/大小: 752 页 / 2557 K
品牌: HITACHI [ HITACHI SEMICONDUCTOR ]
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Section 19 ROM  
(32-kbyte Dual-Power-Supply Flash Memory Version)  
19.1  
Flash Memory Overview  
19.1.1 Flash Memory Operating Principle  
Table 19.1 illustrates the principle of operation of the H8/3434F’s on-chip flash memory.  
Like EPROM, flash memory is programmed by applying a high gate-to-drain voltage that draws  
hot electrons generated in the vicinity of the drain into a floating gate. The threshold voltage of a  
programmed memory cell is therefore higher than that of an erased cell. Cells are erased by  
grounding the gate and applying a high voltage to the source, causing the electrons stored in the  
floating gate to tunnel out. After erasure, the threshold voltage drops. A memory cell is read like  
an EPROM cell, by driving the gate to the high level and detecting the drain current, which  
depends on the threshold voltage. Erasing must be done carefully, because if a memory cell is  
overerased, its threshold voltage may become negative, causing the cell to operate incorrectly.  
Section 19.4.6 shows an optimal erase control flowchart and sample program.  
Table 19.1 Principle of Memory Cell Operation  
Program  
Erase  
Read  
Memory  
cell  
Vg = VPP  
Vg  
Vs = VPP  
Open  
Vd  
Vd  
Memory  
array  
Vd  
0 V  
Open  
Open  
Vd  
0 V  
VPP  
0 V  
0 V  
0 V  
VPP  
0 V  
VCC  
0 V  
0 V  
375  
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