GS816273C-250/225
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
A
Side View
D
aaa
D1
e
Bottom View
∅b
e
Symbol
Min
—
Typ
—
Max
1.70
0.60
0.70
0.38
22.1
Units
Symbol
Min
—
Typ
Max
—
Units
mm
mm
mm
mm
mm
A
A1
∅b
c
mm
mm
mm
mm
mm
D1
E
18.0 (BSC)
14.0
0.40
0.50
0.31
21.9
0.50
0.60
0.36
22.0
13.9
—
14.1
—
E1
e
10.0 (BSC)
1.00 (BSC)
0.15
—
—
D
aaa
—
—
Rev 1.0
Thermal Characteristics
Junction to Ambient (θ)
(°C/W)
Junction to Case (θ)
(°C/W)
Package
0 m/s
1 m/s
2 m/s
209 BGA (C)
17.7
16.0
14.1
2.8
Package Dimensions—119-Pin PBGA
Rev: 1.03 7/2004
23/25
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GSI [ GSI TECHNOLOGY ]
