GS9090 Data Sheet
6.2 Recommended PCB Footprint
0.25
0.50
0.55
CENTER PAD
7.70
6.76
NOTE: All dimensions
are in millimeters.
6.76
7.70
The Center Pad of the PCB footprint should be connected to the CORE_GND
plane by a minimum of 25 vias.
NOTE: Suggested dimensions only. Final dimensions should conform to customer
design rules and process optimizations.
6.3 Packaging Data
Parameter
Value
Package Type
8mm x 8mm 56-pin QFN
Package Drawing Reference
Moisture Sensitivity Level
Junction to Case Thermal Resistance, θj-c
JEDEC M0220
3
12.2°C/W
Junction to Air Thermal Resistance, θj-a (at zero airflow)
25.8°C/W
Psi
9.1°C/W
Yes
Pb-free and RoHS compliant
6.4 Ordering Information
Part Number
Package
Temperature Range
0oC to 70oC
GS9090-CNE3
56-pin QFN
28201 - 1 July 2005
69 of 70
GENNUM [ GENNUM CORPORATION ]
