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5. Package Parameters
The FT245R is supplied in two different packages. The FT245RL is the SSOP-28 option and the FT245RQ is the
QFN-32 package option. The solder reflow profile for both packages is described in Section 5.3.
5.1 SSOP-28 Package Dimensions
7.80 +/-0.40
5.30 +/-0.30
28
1
1.02 Typ.
0.05 Min
0.30 +/-0.012
1.25 +/-0.12
12° Typ
0.09
0.25
0° - 8°
0.75 +/-0.20
0.65 +/-0.026
15
14
Figure 8 - SSOP-28 Package Dimensions
The FT245RL is supplied in a RoHS compliant 28 pin SSOP package. The package is lead ( Pb ) free and uses a
‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package has a 5.30mm x 10.20mm body ( 7.80mm x 10.20mm including pins ). The pins are on a 0.65 mm pitch.
The above mechanical drawing shows the SSOP-28 package – all dimensions are in millimetres.
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.
FT245R USB UART I.C. Datasheet Version 1.05
© Future Technology Devices International Ltd. 2005
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
