5. Package Parameters
Page 12
The FT245R is supplied in two different packages. The FT245RL is the SSOP-28 option and the FT245RQ is the
QFN-32 package option. The solder reflow profile for both packages is described in
5.1 SSOP-28 Package Dimensions
7.80 +/-0.40
5.30 +/-0.30
1.75
+/- 0.10
1.02 Typ.
0.05 Min
0.30 +/-0.012
2.00 Max
1
28
FT245RL
14
12° Typ
1.25 +/-0.12
YYXX-A
10.20 +/-0.30
0.09
0.25
0° - 8°
FTDI
0.65 +/-0.026
0.75 +/-0.20
15
Figure 8 - SSOP-28 Package Dimensions
The FT245RL is supplied in a RoHS compliant 28 pin SSOP package. The package is lead ( Pb ) free and uses a
‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package has a 5.30mm x 10.20mm body ( 7.80mm x 10.20mm including pins ). The pins are on a 0.65 mm pitch.
The above mechanical drawing shows the SSOP-28 package – all dimensions are in millimetres.
The date code format is
YYXX
where XX = 2 digit week number, YY = 2 digit year number.
FT245R USB UART I.C. Datasheet Version 1.05
© Future Technology Devices International Ltd. 2005
FTDI [ FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD. ]
