Package and Pin Listings
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1 Package Parameters for the MPC8540 FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Die size
12.2 mm × 9.5 mm
29 mm × 29 mm
783
Package outline
Interconnects
Pitch
1 mm
Minimum module height
Maximum module height
Solder Balls
3.07 mm
3.75 mm
62 Sn/36 Pb/2 Ag
0.5 mm
Ball diameter (typical)
14.2 Mechanical Dimensions of the MPC8540 FC-PBGA
Figure 43 the mechanical dimensions and bottom surface nomenclature of the MPC8540, 783 FC-PBGA
package.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
66
Freescale Semiconductor
FREESCALE [ Freescale ]
