Package and Pin Listings
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1 Package Parameters for the MPC8540 FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm
×
29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Die size
12.2 mm
×
9.5 mm
Package outline
29 mm
×
29 mm
Interconnects
783
Pitch
1 mm
Minimum module height
3.07 mm
Maximum module height
3.75 mm
Solder Balls
62 Sn/36 Pb/2 Ag
Ball diameter (typical)
0.5 mm
14.2 Mechanical Dimensions of the MPC8540 FC-PBGA
the mechanical dimensions and bottom surface nomenclature of the MPC8540, 783 FC-PBGA
package.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
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Freescale Semiconductor
FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
