Package and Pin Listings
Figure 43. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8540 FC-PBGA
NOTES
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
5. Capacitors may not be present on all devices.
MPC8540 Integrated Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
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