System Design Information
R
θ
JC
= junction to case thermal resistance (°C/W)
P
D
= power dissipation (W)
24 System Design Information
This section provides electrical and thermal design recommendations for successful application of the
MPC8378E.
24.1
PLL Power Supply Filtering
Each of the PLLs listed above is provided with power through independent power supply pins. The AV
DD
level should always be equivalent to V
DD
, and preferably these voltages will be derived directly from V
DD
through a low frequency filter scheme.
There are a number of ways to reliably provide power to the PLLs, but the recommended solution is to
provide five independent filter circuits as illustrated in
one to each of the five AV
DD
pins. By
providing independent filters to each PLL, the opportunity to cause noise injection from one PLL to the
other is reduced.
This circuit is intended to filter noise in the PLLs resonant frequency range from a 500 kHz to 10 MHz
range. It should be built with surface mount capacitors with minimum Effective Series Inductance (ESL).
Consistent with the recommendations of Dr. Howard Johnson in
High Speed Digital Design: A Handbook
of Black Magic
(Prentice Hall, 1993), multiple small capacitors of equal value are recommended over a
single large value capacitor.
Each circuit should be placed as close as possible to the specific AV
DD
pin being supplied to minimize
noise coupled from nearby circuits. It should be possible to route directly from the capacitors to the AV
DD
pin, which is on the periphery of package, without the inductance of vias.
shows the PLL power supply filter circuit.
10
Ω
VDD
2.2 µF
2.2 µF
Low ESL Surface Mount Capacitors
AVDD (or L2AVDD)
GND
Figure 68. PLL Power Supply Filter Circuit
24.2
Decoupling Recommendations
Due to large address and data buses, and high operating frequencies, the device can generate transient
power surges and high frequency noise in its power supply, especially while driving large capacitive loads.
This noise must be prevented from reaching other components in the device system, and the device itself
requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer
place at least one decoupling capacitor at each VDD, OVDD, GVDD, and LVDD pins of the device. These
decoupling capacitors should receive their power from separate VDD, OVDD, GVDD, LVDD, and GND
power planes in the PCB, utilizing short traces to minimize inductance. Capacitors may be placed directly
under the device using a standard escape pattern. Others may surround the part.
MPC8378E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
119