Thermal
Table 67 and Table 68 show heat sink thermal resistance for TBGA and PBGA of the MPC8347EA.
Table 67. Heat Sink and Thermal Resistance of MPC8347EA (TBGA)
35 × 35 mm TBGA
Heat Sink Assuming Thermal Grease
Air Flow
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convection
1 m/s
10
6.5
5.6
8.4
4.7
4
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
AAVID 31 × 35 × 23 mm pin fin
Natural convection
1 m/s
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
2 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
f
Natural convection
1 m/s
5.7
3.5
2.7
6.7
4.1
2.8
3.1
2 m/s
Natural convection
1 m/s
2 m/s
1 m/s
Table 68. Heat Sink and Thermal Resistance of MPC8347EA (PBGA)
29 × 29 mm PBGA
Heat Sink Assuming Thermal Grease
Air Flow
Thermal Resistance
AAVID 30 × 30 × 9.4 mm pin fin
Natural convection
1 m/s
13.5
9.6
8.8
11.3
8.1
7.5
9.1
7.1
6.5
10.1
7.7
6.6
6.9
AAVID 30 × 30 × 9.4 mm pin fin
AAVID 30 × 30 × 9.4 mm pin fin
2 m/s
AAVID 31 × 35 × 23 mm pin fin
Natural convection
1 m/s
AAVID 31 × 35 × 23 mm pin fin
AAVID 31 × 35 × 23 mm pin fin
2 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Natural convection
1 m/s
Wakefield, 53 × 53 × 25 mm pin fin
Wakefield, 53 × 53 × 25 mm pin fin
2 m/s
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 no adjacent board, extrusion
MEI, 75 × 85 × 12 mm, adjacent board, 40 mm side bypass
Natural convection
1 m/s
2 m/s
1 m/s
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12
Freescale Semiconductor
88
FREESCALE [ Freescale ]
