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MPC8347ECVVAGDB 参数 Datasheet PDF下载

MPC8347ECVVAGDB图片预览
型号: MPC8347ECVVAGDB
PDF下载: 下载PDF文件 查看货源
内容描述: MPC8347EA的PowerQUICC II Pro整合型主机处理器的硬件规格 [MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications]
分类和应用: 外围集成电路PC时钟
文件页数/大小: 99 页 / 727 K
品牌: FREESCALE [ Freescale ]
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Thermal  
Shin-Etsu MicroSi, Inc.  
10028 S. 51st St.  
Phoenix, AZ 85044  
888-642-7674  
800-347-4572  
Internet: www.microsi.com  
The Bergquist Company  
18930 West 78th St.  
Chanhassen, MN 55317  
Internet: www.bergquistcompany.com  
20.3 Heat Sink Attachment  
When heat sinks are attached, an interface material is required, preferably thermal grease and a spring clip.  
The spring clip should connect to the printed-circuit board, either to the board itself, to hooks soldered to  
the board, or to a plastic stiffener. Avoid attachment forces that can lift the edge of the package or peel the  
package from the board. Such peeling forces reduce the solder joint lifetime of the package. The  
recommended maximum force on the top of the package is 10 lb force (4.5 kg force). Any adhesive  
attachment should attach to painted or plastic surfaces, and its performance should be verified under the  
application requirements.  
20.3.1 Experimental Determination of the Junction Temperature with a  
Heat Sink  
When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the  
interface between the case of the package and the interface material. A clearance slot or hole is normally  
required in the heat sink. Minimize the size of the clearance to minimize the change in thermal  
performance caused by removing part of the thermal interface to the heat sink. Because of the experimental  
difficulties with this technique, many engineers measure the heat sink temperature and then back calculate  
the case temperature using a separate measurement of the thermal resistance of the interface. From this  
case temperature, the junction temperature is determined from the junction-to-case thermal resistance.  
T = T + (R  
× P )  
D
J
C
θJC  
where:  
T = junction temperature (°C)  
J
T = case temperature of the package (°C)  
C
R
= junction-to-case thermal resistance (°C/W)  
θJC  
P = power dissipation (W)  
D
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12  
90  
Freescale Semiconductor