Peripheral operating requirements and behaviors
5.4.2 Thermal attributes
Table 10. Thermal attributes
Board type
Symbol
Description
80
64
48 QFN 32 QFN
Unit
Notes
LQFP
LQFP
Single-layer (1S)
RθJA
Thermal resistance, junction
to ambient (natural
convection)
70
53
—
—
71
52
59
46
84
28
69
22
92
33
75
27
°C/W
1
Four-layer (2s2p)
Single-layer (1S)
Four-layer (2s2p)
RθJA
Thermal resistance, junction
to ambient (natural
convection)
°C/W
°C/W
°C/W
RθJMA Thermal resistance, junction
to ambient (200 ft./min. air
speed)
RθJMA Thermal resistance, junction
to ambient (200 ft./min. air
speed)
—
—
—
RθJB
RθJC
ΨJT
Thermal resistance, junction
to board
34
15
34
20
5
10
2.0
5.0
12
1.8
8
°C/W
°C/W
°C/W
2
3
4
Thermal resistance, junction
to case
Thermal characterization
parameter, junction to
package top outside center
(natural convection)
0.6
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
—Junction-to-Board.
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 SWD Electricals
Table 11. SWD full voltage range electricals
Symbol
Description
Min.
Max.
Unit
Operating voltage
1.71
3.6
V
Table continues on the next page...
KL24 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
Freescale Semiconductor, Inc.
23
FREESCALE [ Freescale ]
