General
2. VDD = 3.3 V, TA = 25 °C, fOSC = 8 MHz (crystal), fSYS = 48 MHz, fBUS = 48 MHz
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method
5.2.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
1. Go to www.freescale.com.
2. Perform a keyword search for “EMC design.”
5.2.8 Capacitance attributes
Table 8. Capacitance attributes
Symbol
CIN_A
Description
Min.
—
Max.
Unit
pF
Input capacitance: analog pins
Input capacitance: digital pins
7
7
CIN_D
—
pF
5.3 Switching specifications
5.3.1 Device clock specifications
Symbol
Description
Min.
Max.
Unit
Notes
Normal run mode
fSYS
fBUS
System and core clock
Bus clock
—
—
—
20
48
24
24
—
MHz
MHz
MHz
MHz
fFLASH
Flash clock
fSYS_USB System and core clock when Full Speed USB in
operation
fLPTMR
LPTMR clock
—
24
MHz
VLPR mode1
fSYS
fBUS
System and core clock
Bus clock
—
—
—
—
—
—
4
1
MHz
MHz
MHz
MHz
MHz
MHz
fFLASH
fLPTMR
fERCLK
Flash clock
1
LPTMR clock
24
16
24
External reference clock
fLPTMR_pin LPTMR clock
Table continues on the next page...
KL24 Sub-Family Data Sheet Data Sheet, Rev. 3, 9/19/2012.
Freescale Semiconductor, Inc.
21
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