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MC9S08QE8 参数 Datasheet PDF下载

MC9S08QE8图片预览
型号: MC9S08QE8
PDF下载: 下载PDF文件 查看货源
内容描述: 8位HCS08中央处理器 [8-Bit HCS08 Central Processor Unit]
分类和应用:
文件页数/大小: 46 页 / 942 K
品牌: FREESCALE [ Freescale ]
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Electrical Characteristics  
Input must be current limited to the value specified. To determine the value of the required  
1
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp  
voltages, then use the larger of the two resistance values.  
2
3
All functional non-supply pins, except for PTA5 are internally clamped to VSS and VDD  
.
Power supply must maintain regulation within operating VDD range during instantaneous and  
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than  
IDD, the injection current may flow out of VDD and could result in external power supply going  
out of regulation. Ensure external VDD load will shunt current greater than maximum injection  
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if  
no system clock is present, or if the clock rate is very low (which would reduce overall power  
consumption).  
3.4  
Thermal Characteristics  
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power  
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and  
it is user-determined rather than being controlled by the MCU design. To take P into account in power calculations, determine  
I/O  
the difference between actual pin voltage and V or V and multiply by the pin current for each I/O pin. Except in cases of  
SS  
DD  
unusually high pin current (heavy loads), the difference between pin voltage and V or V will be very small.  
SS  
DD  
Table 4. Thermal Characteristics  
Symbol  
Rating  
Value  
Unit  
Operating temperature range  
(packaged)  
TL to TH  
–40 to 85  
TA  
°C  
°C  
Maximum junction temperature  
TJM  
95  
Thermal resistance  
Single-layer board  
32-pin LQFP  
28-pin SOIC  
20-pin SOIC  
16-pin PDIP  
16-pin TSSOP  
66  
57  
θJA  
71  
°C/W  
64  
108  
Thermal resistance  
Four-layer board  
32-pin LQFP  
28-pin SOIC  
20-pin SOIC  
16-pin PDIP  
16-pin TSSOP  
47  
42  
52  
47  
78  
θJA  
°C/W  
The average chip-junction temperature (T ) in °C can be obtained from:  
J
T = T + (P × θ )  
JA  
Eqn. 1  
J
A
D
where:  
MC9S08QE8 Series, Rev. 3  
Freescale Semiconductor  
Preliminary  
9
Subject to Change Without Notice  
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