Freescale Semiconductor, Inc.
Electrical Specifications
Operating Temperature Range
13.4 Operating Temperature Range
(1)
Symbol
Value
Unit
Rating
(2)
Operating temperature range
MC68HC705C8ACB
MC68HC705C8ACFB
MC68HC705C8ACFS
MC68HC705C8ACP
T to T
L
H
T
°C
A
– 40 to + 85
MC68HC705C8ACFN
MC68HC705C8ACFS
1. Voltages referenced to V
SS
2. C = Extended temperature range (– 40°C to + 85°C)
P = Plastic dual in-line package (PDIP)
B = Plastic shrink dual in-line package (SDIP)
S = Ceramic dual in-line package (cerdip)
FN = Plastic-leaded chip carrier (PLCC)
FB = Quad flat pack (QFP)
FS = Ceramic-leaded chip carrier (CLCC)
13.5 Thermal Characteristics
Characteristic
Thermal resistance
Symbol
Value
Unit
Plastic dual in-line package (DIP)
Ceramic dual in-line package (cerdip)
Plastic leaded chip carrier (PLCC)
Quad flat pack (QFP)
60
50
70
95
60
θ
°C/W
JA
Plastic shrink DIP (SDIP)
V
= 4.5 V
DD
V
DD
Pins
R1
R2
C
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
R2
3.26 kΩ
2.38 kΩ
50 pF
(SEE TABLE)
TEST
POINT
C
R1
(SEE TABLE)
(SEE TABLE)
V
= 3.0 V
DD
Pins
R1
R2
C
PA7–PA0
PB7–PB0
PC7–PC0
PD4–PD1
10.91 kΩ
6.32 kΩ
50 pF
PD7, PD5, PD0
6 kΩ
6 kΩ
200 pF
Figure 13-1. Equivalent Test Load
MC68HC705C8A — Rev. 3
MOTOROLA
Technical Data
Electrical Specifications
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