Mechanical Data and Ordering Information
16 Mechanical Data and Ordering Information
Table 35 identifies the packages and operating frequencies available for the MPC875/870.
Table 35. Available MPC875/870 Packages/Frequencies
Package Type
Temperature (Tj) Frequency (MHz) Order Number
Plastic ball grid array
ZT suffix — Leaded
VR suffix — Lead-Free are available as needed
0°C to 95°C
66
KMPC875ZT66
KMPC870ZT66
MPC875ZT66
MPC870ZT66
80
KMPC875ZT80
KMPC870ZT80
MPC875ZT80
MPC870ZT80
133
66
KMPC875ZT133
KMPC870ZT133
MPC875ZT133
MPC870ZT133
Plastic ball grid array
CZT suffix — Leaded
CVR suffix — Lead-Free are available as needed
-40°C to 100°C
KMPC875CZT66
KMPC870CZT66
MPC875CZT66
MPC870CZT66
133
KMPC875CZT133
KMPC870CZT133
MPC875CZT133
MPC870CZT133
16.1 Pin Assignments
Figure 68 shows the JEDEC pinout of the PBGA package as viewed from the top surface. For additional
information, see the MPC885 PowerQUICC Family User’s Manual.
NOTE
The pin numbering starts with B2 in order to conform to the JEDEC standard for
23-mm body size using a 16 × 16 array.
MPC875/MPC870 Hardware Specifications, Rev. 3.0
71
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
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