Power Requirements
5
Power Requirements
To prevent high current conditions due to possible improper sequencing of the power supplies, the connection shown below is
recommended to be made between the DSP56371 IO_VDD and CORE_VDD power pins.
IO VDD
External
Schottky
Diode
CORE VDD
To prevent a high current condition upon power up, the IOVDD must be applied ahead of the CORE VDD as shown below if the
external Schottcky is not used.
CORE VDD
IO VDD
6
Thermal Characteristics
Table 15. Thermal Characteristics
Characteristic
Symbol
TQFP Value
Unit
Natural Convection, Junction-to-ambient thermal
resistance1,2
RθJA or θJA
39
°C/W
Junction-to-case thermal resistance3
RθJC or θJC
18.25
°C/W
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-
883 Method 1012.1).
32
DSP56371 Technical Data
Freescale Semiconductor
FREESCALE [ Freescale ]
