Thermal specifications
tTCLK
tclkh
TCLK
tclkl
Figure 9. Timer external clock
tICPW
FTMCHn
FTMCHn
tICPW
Figure 10. Timer input capture pulse
5.3 Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take PI/O into account in
power calculations, determine the difference between actual pin voltage and VSS or VDD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
Table 8. Thermal characteristics
Rating
Symbol
Value
Unit
Operating temperature range
(packaged)
TA
-40 to 105
°C
Junction temperature range
TJ
-40 to 150
°C
Thermal resistance single-layer board
64-pin LQFP
64-pin QFP
48-pin LQFP
44-pin LQFP
32-pin LQFP
θJA
θJA
θJA
θJA
θJA
71
61
81
75
86
°C/W
°C/W
°C/W
°C/W
°C/W
Table continues on the next page...
MC9S08PA60 Series Data Sheet, Rev. 1, 10/9/2012.
16
Freescale Semiconductor, Inc.
FREESCALE [ Freescale ]
