ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
V
V
SUP
Continuous Supply Voltage
Transient Voltage (Load Dump)
27
40
WAKE DC and Transient Voltage (Through a 33 kΩ Serial Resistor)
V
-18 to 40
V
V
V
WAKE
Logic Voltage (RXD, TXD, EN Pins)
V
-0.3 to 5.5
LOG
BUS
LIN Bus Voltage
V
DC Voltage
-18 to 40
Transient (Coupled Through 1.0 nF Capacitor)
-150 to 100
INH Voltage/Current
DC Voltage
V
I
-0.3 to V
+ 0.3
SUP
V
INH
40
mA
DC Current
INH
ESD Voltage (1)
V
V
ESD1
Human Body Model
All Pins
±2000
±5000
±200
LIN Pin with Respect to Ground
Machine Model
V
ESD2
THERMAL RATINGS
Operating Temperature
Ambient
°C
°C
T
A
-40 to 125
-40 to 150
T
J
Junction
Storage Temperature
TSTG
RθJA
-40 to 150
150
Thermal Resistance, Junction to Ambient
°C/W
°C
Peak Package Reflow Temperature During Reflow (2)
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis Temperature
Notes
,
TPPRT
Note 3.
(3)
T
T
150 to 200
8.0 to 20
°C
°C
SHUT
HYST
1
ESD1 testing is performed in accordance with the Human Body Model (C
= 100 pF, R
= 1500 Ω), ESD2 testing is performed in
ZAP
ZAP
accordance with the Machine Model (C
= 220 pF, R
= 0 Ω).
ZAP
ZAP
2
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
33661
Analog Integrated Circuit Device Data
Freescale Semiconductor
4
FREESCALE [ Freescale ]
