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33661 参数 Datasheet PDF下载

33661图片预览
型号: 33661
PDF下载: 下载PDF文件 查看货源
内容描述: 本地区域网络( LIN)增强的物理接口,可选择摆率 [Local Area Network (LIN) Enhanced Physical Interface with Selectable Slew Rate]
分类和应用: 电感器
文件页数/大小: 21 页 / 566 K
品牌: FREESCALE [ FREESCALE SEMICONDUCTOR, INC ]
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Freescale Semiconductor
Advance Information
Document Number: MC33661
Rev. 6.0, 11/2006
Local Area Network (LIN)
Enhanced Physical Interface
with Selectable Slew Rate
Local Interconnect Network (LIN) is a serial communication protocol
designed to support automotive networks in conjunction with Controller
Area Network (CAN). As the lowest level of a hierarchical network, LIN
enables cost-effective communication with sensors and actuators
when all the features of CAN are not required.
The 33661 is a Physical Layer component dedicated to automotive
LIN sub-bus applications. It offers slew rate selection for optimized
operation at 10 kbps and 20 kbps, fast baud rate (above 100 kbps) for
test and programming modes, excellent radiated emission
performance, and safe behavior in the event of LIN bus short-to-ground
or LIN bus leakage during low-power mode.
The 33661 is compatible with LIN Protocol Specification 2.0.
Features
• Operational from V
SUP
6.0 V to 18 V DC, Functional up to 27 V DC,
and Handles 40 V During Load Dump
• Active Bus Waveshaping Offering Excellent Radiated Emission
Performance
• 5.0 kV ESD on LIN Bus Pin
• 30 kΩ Internal Pullup Resistor
• LIN Bus Short-to-Ground or High Leakage in Sleep Mode
• -18 V to +40 V DC Voltage at LIN Pin
• 8.0
µA
in Sleep Mode
• Local and Remote Wake-Up Capability Reported by INH and
RXD Pins
• 5.0 V and 3.3 V Compatible Digital Inputs Without Any External
Components Required
• Pb-Free Packaging Designated by Suffix Code EF
33661
LIN PHYSICAL INTERFACE
D SUFFIX
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
ORDERING INFORMATION
Device
MC33661D/R2
- 40°C to 125°C
MCZ33661EF/R2
8 SOICN
Temperature
Range (T
A
)
Package
V
PWR
33661
WAKE
V
DD
Regulator
12 V
5.0
V
VSUP
INH
EN
MCU
RXD
TXD
LIN
GND
LIN Bus
Figure 1. 33661 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006. All rights reserved.