ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
80
80
7700
60
60
50
50
40
40
3300
20
20
R
[°C/W]
JA
x
θ
1100
0
0
0
300
600
0
300
600
2
Heat spreading area
Heat Spreading Area A [m[mm]m²]
A
Figure 30. Device on Thermal Test Board RθJA
100
100
10
10
R
x
θ
JA [°C/W]
1
1
0.1
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time [s]
Time[s]
Figure 31. Transient Thermal Resistance RθJA
1 W Step Response, Device on Thermal Test Board Area A = 600 (mm2)
33186
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
FREESCALE [ Freescale ]
