PACKAGING
SOLDERING
PACKAGING
SOLDERING
The 20 HSOP package is designed for enhanced thermal
performance. The particularity of this package is its copper
base plate on which the power die is soldered. The base plate
is soldered on a PCB to provide heat flow to the ambient and
also to provide a large thermal capacitance.
100
Of course, the more copper area on the PCB, the better
the power dissipation and transient behavior.
10
We characterized the 20 HSOP on a double side PCB.
The bottom side area of the copper is 7.8 cm2. The top
surface is 2.7 cm2, see Figure 26.
Rth (°C/W)
1
0,1
0,001
0,01
0,1
1
10
t, Time (s)
100
1000
10000
Figure 27. PHSOP20 Thermal Response
Figure 27 shows the thermal response with the device
soldered on to the test PCB described on Figure 26.
Top Side
Bottom Side
Figure 26. PCB Test Layout
33186
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
FREESCALE [ Freescale ]
