ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
A
AGND
SF
NC
1
20
19
18
17
16
15
14
13
12
11
IN2
2
IN1
DI1
3
VBAT
VBAT
OUT1
OUT1
COD
PGND
PGND
4
CP
5
VBAT
OUT2
OUT2
DI2
6
7
8
9
PGND
PGND
10
33186DH1 Pin Connections
20-Pin HSOP-EP
1.6 mm Pitch
16.0 mm x 11.0 mm Body
12.3 x 7.1 mm exposed pad
Figure 29. Thermal Test Board
Device on Thermal Test Board
Table 6. Thermal Resistance Performance
A [mm2]
RθJA [°C/W]
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
0
70
49
47
Cu traces, 0.07 mm thickness
300
Outline:
Area A:
80 mm x 100 mm board area,
including edge connector for
thermal testing
600
RθJA is the thermal resistance between die junction and
ambient air.
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
33186
Analog Integrated Circuit Device Data
Freescale Semiconductor
18
FREESCALE [ Freescale ]
