PACKAGING
PACKAGE DIMENSIONS
PACKAGE DIMENSIONS
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PIN ONE ID
NOTES:
h
X 45
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
E2
E3
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.150 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
20
1
D1
D
A
10
11
6. DATUMS –A– AND –B– TO BE DETERMINED AT
DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE TIEBAR
PROTRUSIONS. ALLOWABLE TIEBAR
PROTRUSIONS ARE 0.150 PER SIDE.
EXPOSED
HEATSINK AREA
B
E1
E4
10X
E
MILLIMETERS
BOTTOM VIEW
DIM
A
A1
A2
A3
D
MIN
3.000
0.100
2.900
0.00
MAX
3.400
0.300
3.100
0.100
M
bbb
C
B
DATUM
Y
H
PLANE
b1
15.800 16.000
A2
A
D1 11.700 12.600
D2
E
0.900
13.950 14.450
1.100
c1
c
E1 10.900 11.100
SEATING
C
E2
E3
E4
L
2.500
6.400
2.700
0.840
2.700
7.200
2.900
1.100
PLANE
b
M
aaa
C A
L1
b
b1
c
c1
e
0.350 BSC
0.400
0.400
0.230
0.230
0.520
0.482
0.320
0.280
SECTION W–W
GAUGE
PLANE
L1
W
1.270 BSC
h
–––
0
1.100
8
W
L
bbb
C
aaa
bbb
0.200
0.100
(1.600)
DETAIL Y
DH1 SUFFIX
VWC1 SAUSFEFIX97(P9BC-F–R0E2E)
20-PIN HSOP
ISSUE A
PLASTIC PACKAGE
98ASH70702A
DATE 07/22/98
ISSUE A
33186
Analog Integrated Circuit Device Data
Freescale Semiconductor
16
FREESCALE [ Freescale ]
