Document Revision History
22.2 Part Marking
Parts are marked as in the example shown in Figure 44.
MPCnnnnetppaaar
core/platform MHZ
ATWLYYWW
CCCCC
*MMMMM
YWWLAZ
TBGA
Notes:
ATWLYYWW is the traceability code.
CCCCC is the country code.
MMMMM is the mask number.
YWWLAZ is the assembly traceability code.
Figure 44. Freescale Part Marking for TBGA Devices
23 Document Revision History
This table provides a revision history of this document.
Table 68. Document Revision History
Rev.
Number
Date
Substantive Change(s)
13
09/2011
• In Section 2.2, “Power Sequencing,” added Section 2.2.1, “Power-Up Sequencing” and Figure 4.
• In Table 25, Table 29 and Table 31, removed the GTX_CLK125.
• In Table 34, updated tMDKHDX Max value from 170ns to 70ns.
12
11
10
11/2010
05/2010
5/2009
• In Table 55 added note for pin LGPL4.
• In Section 21.7, “Pull-Up Resistor Requirements, updated the list of open drain type pins.
• In Table 25 through Table 30, changed VIL(min) to VIH(max) to (20%–80%).
• Added Table 8, “EC_GTX_CLK125 AC Timing Specifications.”
• In Table 57, updated frequency for max csb_clk to 333 MHz and DDR2, from 100-200 to 100-133
at core frequency = 533MHz.
• In Section 18.1, “Package Parameters for the MPC8349EA TBGA, changed solder ball for TBGA
and PBGA from 95.5 Sn/0.5 Cu/4 Ag to 96.5 Sn/3.5 Ag.
• In Table 66, footnote 1, changed 667(TBGA) to 533(TBGA). footnote 4, added data rate for DDR1
and DDR2.
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
84