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1500457 参数 Datasheet PDF下载

1500457图片预览
型号: 1500457
PDF下载: 下载PDF文件 查看货源
内容描述: 综合主机处理器的硬件规格 [Integrated Host Processor Hardware Specifications]
分类和应用:
文件页数/大小: 87 页 / 680 K
品牌: FREESCALE [ Freescale ]
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Thermal  
Table 63. Package Thermal Characteristics for TBGA (continued)  
Characteristic  
Symbol  
Value  
Unit  
Notes  
Junction-to-package natural convection on top  
ψJT  
1
°C/W  
6
Notes:  
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)  
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal  
resistance.  
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.  
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).  
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on  
the top surface of the board near the package.  
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method  
1012.1).  
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature  
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.  
20.2 Thermal Management Information  
For the following sections, P = (V × I ) + P where P is the power dissipation of the I/O drivers.  
D
DD  
DD  
I/O  
I/O  
See Table 5 for I/O power dissipation values.  
20.2.1 Estimation of Junction Temperature with Junction-to-Ambient  
Thermal Resistance  
An estimation of the chip junction temperature, T , can be obtained from the equation:  
J
T = T + (R  
× P )  
D
J
A
θJA  
where:  
T = junction temperature (°C)  
J
T = ambient temperature for the package (°C)  
A
R
= junction-to-ambient thermal resistance (°C/W)  
θJA  
P = power dissipation in the package (W)  
D
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy  
estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for  
a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually  
appropriate if the board has low power dissipation and the components are well separated. Test cases have  
demonstrated that errors of a factor of two (in the quantity T – T ) are possible.  
J
A
20.2.2 Estimation of Junction Temperature with Junction-to-Board  
Thermal Resistance  
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal  
resistance. The thermal performance of any component is strongly dependent on the power dissipation of  
surrounding components. In addition, the ambient temperature varies widely within the application. For  
many natural convection and especially closed box applications, the board temperature at the perimeter  
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13  
Freescale Semiconductor  
75