Thermal
Table 62. Suggested PLL Configurations (continued)
400 MHz Device 533 MHz Device
RCWL
667 MHz Device
Input
Input
Input
Ref
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
CSB
Freq
(MHz)
Core
Freq
(MHz)
No.1
CORE
PLL
Clock
Freq
Clock
Freq
Clock
Freq
SPMF
(MHz)2
(MHz)2
(MHz)2
306
405
0011
0100
0101
0000110
0000101
0000100
—
—
—
—
—
—
66
66
66
200
266
333
600
667
667
504
1
The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and
COREPLL settings given in the table.
The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.
2
20 Thermal
This section describes the thermal specifications of the MPC8349EA.
20.1 Thermal Characteristics
Table 63 provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8349EA.
Table 63. Package Thermal Characteristics for TBGA
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single-layer board (1s)
Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (at 2 m/s) on single-layer board (1s)
Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
RθJA
RθJMA
RθJMA
RθJMA
RθJMA
RθJMA
RθJB
14
11
11
8
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
4
9
7
3.8
1.7
Junction-to-case thermal
RθJC
5
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
74
FREESCALE [ Freescale ]
