Typical Electrical and Thermal Characteristics (continued)
25
20
15
10
5
2.5
2
VDS = -10V
1a
T
= -55°C
J
25°C
125°C
1.5
1
1b
1c
4.5"x5" FR-4 Board
TA
25o
Still Air
=
C
0
0.5
0
-5
-10
-15
-20
-25
-30
0
0.2
0.4
0.6
0.8
1
2
I
, DRAIN CURRENT (A)
2oz COPPER MOUNTING PAD AREA (in
)
D
Figure 13. Transconductance Variation with Drain
Current and Temperature.
Figure 14. SO-8 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad Area.
8
7
6
50
30
10
1a
3
1
1b
1c
0.3
0.1
VGS = -10V
SINGLE PULSE
5
4.5"x5" FR-4 Board
TA
Still Air
= C
25 o
R JA = See Note 1c
q
0.03
0.01
TA = 25°C
VGS
=
-10V
4
0
0.2
0.4
0.6
0.8
1
0.1
0.2
0.5
- V
1
2
5
10
30
50
2
)
2oz COPPER MOUNTING PAD AREA (in
, DRAIN-SOURCE VOLTAGE (V)
DS
Figure 16. Maximum Safe Operating Area.
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
1
D = 0.5
0.2
0.5
0.2
0.1
R
(t) = r(t) * R
JA
q
JA
q
R
= See Note 1c
0.1
0.05
JA
q
0.05
P(pk)
0.02
0.01
Single Pulse
0.02
0.01
t
1
t
2
0.005
T
- T
= P * R
(t)
2
J
JA
A
q
Duty Cycle, D = t / t
1
0.002
0.001
0.0001
0.001
0.01
0.1
1
10
100
300
t1, TIME (sec)
Figure 17. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDS8435 Rev. B2
FAIRCHILD [ FAIRCHILD SEMICONDUCTOR ]
