Electrical Characteristics (continued)
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Type Min Typ Max Units
Switching Characteristics (Note 2)
td(on)
tr
td(off)
tf
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Q1
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
15
15
5
27
27
10
27
61
64
20
40
27
21
ns
ns
VDD = 15 V, ID = 1 A,
VGS = 10V, RGEN = 6 W
Q1
VDD = –10 V, ID = –1 A,
VGS = –4.5V, RGEN = 6 W
15
38
40
10
25
17
13
4
ns
ns
Qg
Q1
nC
nC
nC
VDS = 15 V, ID = 9.3 A, VGS = 4.5 V
Qgs
Qgd
Q2
2.5
5
2.0
VDS = 15 V, ID = –2.4 A,VGS = –4.5 V
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
Q1
Q2
Q1
Q2
2.1
–2.1
1.2
–1.2
A
V
VSD
Drain-Source Diode Forward VGS = 0 V, IS = 2.1 A (Note 2)
Voltage
VGS = 0 V, IS = –2.1 A (Note 2)
Notes:
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.
a) 50°C/W when
mounted on a
1 in pad of 2 oz
b) 105°C/W when
mounted on a 0.04
in2 pad of 2 oz
copper
c) 125°C/W when mounted on a
minimum pad.
2
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%
FDS4501H Rev C(W)