Table 7-2. Thermal Resistance
Symbol
Parameter
Max
Units
Thermal Resistance, Junction to Case (infinite heatsink on package
top)
3.9
θjc
°C/W
Tjmax
Maximum Junction Temperature
125
°C
For an 8 layer PC board
Thermal Resistance, Junction to Ambient in still air
13.0
11.1
θja
°C/W
°C/W
Thermal Resistance, Junction to Ambient at 200LF/M (1m/s)
airflow
θja at
200LFM
Thermal Resistance, Junction to Ambient at 400LF/M (2m/s)
airflow
10.4
17.0
θja at
°C/W
400LFM
For an 4 layer PC board
Thermal Resistance, Junction to Ambient in still air
θja
°C/W
Note
1. Significant variations in the thermal performance of a package can be expected due to system
variables, such as PWB construction, adjacent devices, or actual air flow across the package.
2. A single device is mounted in the center of the card. Air flow is across the top and bottom of the
test card.
3. Junction Temperature, Tj = (Theta_Ja x Power) + Ambient Temperature.
4. Ambient temperature is assumed to be 70°C.
7.3 Recommended Operating Conditions
Table 7-3. Recommended Operating Conditions
DC Supply I/O Voltage (vdde) Nominal: 3.3V
+3.0V to +3.6V
+3.0V to +3.6V
DC Supply I/O Voltage (vddh) Nominal: 3.3V (If host is configured for
GMII - LVCMOS 3.3V)
DC Supply I/O Voltage (vddh, vddn) Nominal: 1.5V (Can be configured for
either HSTL - 1.5V or LVCMOS - 2.5V)
+1.35 to +2.75V
DC Supply I/O Voltage (vdds) Nominal: 1.0V
+0.97V to +1.03V
+0.97V to +1.03V
DC Supply Voltage, Core power (vddi, vdda_pll, vdda_serdes) Nominal:
1.0V
DC Supply I/O Voltage (vddr) Nominal: 1.8V (for DDR2)
Ambient Operating Temperature
+1.7V to +1.9V
0°C to +70°C
Note
1. DC Supply Voltage limits are as delivered at the pins (balls) of the device.
2. The DC information is preliminary and subject to change
4450 – Data Sheet, DS-0131-06
Page65
Hifn Confidential
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